Polyimide PI Film 0.125mm 25 Micron Grade Non Adhesive
Backing Thickness
0.025/0.05/0.075mm
Total Thickness
0.035~0.12mm
Backing
Polyimide Film
Anti-heat
300C
Color
Gold/Black
Size
Can Be Customized
Sample
Free Sample
Application
Motor,PCB, 3D printing
Certificates
ISO9001
Packaging and delivery
Packaging Details
High Temperature 3D Printer PCB Protective Insulation Polyimide PI Film 0.125mm 25 Micron Grade Non Adhesive Packing:
Inner packing:
Die Cutting Items: with PE bag to protection the product
Jumbo roll: plastic film + air bubble film+ corrugated board wrapping
Outer packing:
Cut roll: hard carton
Jumbo roll: wooden case